Schenzen, CHINA - February 3, 2011 - Tensilica, Inc. today announced that HiSilicon Technologies, a division of Huawei, has expanded its license (announced February 9, 2010) for Tensilica's dataplane processors (DPUs), ConnX Baseband Engine (BBE16), and HiFi Audio DSP (digital signal processing) semiconductor IP cores for LTE (Long-Term Evolution) basestations, handsets and other network infrastructure and customer premise equipment.

"Now that we've worked for over a year with Tensilica, we are quite impressed with the capabilities, ease of use, and efficiency in terms of power, performance, and area achieved with Tensilica DPUs," stated Teresa He, vice president of HiSilicon. "We have used Tensilica's Vectra and ConnX BBE16 and they are best-in-class for baseband signal processing and can be optimized to improve speed, power and performance. We have also selected Tensilica's HiFi Audio DSP core, which provides performance at the lowest power and comes complete with software support for the major audio and voice standards."

"We are very pleased that HiSilicon, the leader in LTE networks, has expanded its use of Tensilica DPUs through this multi-year agreement," stated Jack Guedj, Tensilica's president and CEO. "HiSilicon's broad adoption of Tensilica, in both mobile wireless and network infrastructure designs, is a testimonial to the benefits of our ability to achieve best-in-class speed, performance and power that can be rapidly optimized to precisely tailor to each SOC design without compromise."