Qualcomm has announced its fourth-generation 3G/LTE multimode solutions with the newest modem chipset, the Qualcomm® Gobi™ 9x35, and RF transceiver chip, the Qualcomm WTR3925, designed for 4G LTE Advanced mobile broadband connectivity. According to company, together, these solutions are designed to deliver up to 2X faster LTE Advanced, CAT 6 up to 300 Mbps, along with dual carrier HSUPA and dual band multi-carrier HSPA+.

The Qualcomm Gobi 9x35 is cellular modem based on the 20 nm technology node with support for global carrier aggregation deployments up to 40 MHz for both LTE TDD and FDD Category 6 with download speeds of up to 300 Mbps. The Gobi 9x35 is backwards compatible and supports all other major cellular technologies, including DC-HSPA, EVDO Rev. B, CDMA 1x, GSM and TD-SCDMA. The Qualcomm WTR3925 is RF transceiver chip based on the 28 nm process, and is Qualcomm Technologies’ first single-chip, carrier aggregation RF solution that supports all carrier aggregation band combinations approved by 3GPP. The WTR3925 pairs with the Gobi 9x35 chipset and the Qualcomm RF360™ Front End Solution, which enable the mobile industry’s premier global, single-SKU LTE platform.

The Gobi 9x35 and WTR3925 are specifically designed to use less power and occupy less printed circuit board area and continue the trend towards tighter integration, smaller size and increased performance. The 40 MHz carrier aggregation capability of the Gobi 9x35, coupled with the comprehensive carrier aggregation band support of the WTR3925, is engineered to allow network operators to combine their fragmented spectrum in all possible 3GPP-approved combinations of 5 MHz, 10 MHz, 15 MHz, and 20 MHz bandwidths to increase capacity and service more subscribers with an improved end-user experience. The WTR3925 also incorporates the Qualcomm IZat™ location platform designed for delivery of seamless, global location.