Agilent and Innofidei collaborate to develop RF tests for TD-LTE chipset

in News, Agilent, Innofidei, TD-LTE, LTE

Agilent and Innofidei have announced joint development to complete the requirements for a TD-LTE data dongle RF test.

The test development is based on the 3GPP LTE specifications, Innofidei's TD-LTE test requirements, and included Agilent's N5182A signal generator combined with the N9020A signal analyzer. 

"As a leader of wireless test, Agilent is committed to providing TD-SCDMA and TD-LTE test solutions," said Lan Tao, president of Agilent China. 

"Agilent desires to work with leading chipset vendors such as Innofidei to build up the TD-LTE ecosystem and plans to be one of the key test contributors when China deploys its next-generation wireless applications," Lan Tao added.

"This is a milestone for both companies and We appreciate this close collaboration with Agilent, which allowed us to meet our test requirements," said Tom Zhang, CEO of Innofidei.

Previously, Innofidei along with ASTRI has completed a large amount of interoperability tests (IOT) with major TD-LTE infrastructure providers in the Shanghai World Expo, including Motorola, Alcatel-Lucent Shanghai Bell and ZTE. 

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