March 22, 2010 - Tensilica, Inc today announced that NTT DOCOMO has confirmed that several Tensilica Xtensa LX dataplane processor cores (DPUs) are used in the latest LTE (Long-Term Evolution) mobile handset system-on-chip (SOC) design demonstrated in February at the Mobile World Congress (Barcelona, Spain). NTT DOCOMO previously exhibited the device developed under a collaborative project among DOCOMO, Fujitsu, NEC and Panasonic Mobile Communications (Panasonic Mobile), who will deploy the chip for their LTE handsets and datacards.

"Tensilica's DPUs helped us pack the LTE functions in a small and power-efficient footprint, and they contributed greatly to the efficient implementation and first-time silicon success of our LTE chip," stated Toshio Miki, Associated Senior Vice President & Managing Director of Communication Device Development Department of NTT DOCOMO. "We also achieved a faster time to market and gained post-silicon flexibility due to programmability without sacrificing power or area efficiency."

"The DOCOMO project is clearly leading the race to bring LTE technology to the market, and we are delighted to have had the opportunity to contribute to this rapid and successful development, which was demonstrated integrated into an LTE terminal and an LTE datacard at last month's Mobile World Congress," stated Jack Guedj, Tensilica's president and CEO. "The project proves that our Xtensa DPUs provide both programmability and speed/power efficiency to help designers meet the high performance requirements of LTE wireless modems."